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Laser Cutting System

Application package
PCB of CIPOSmini(30B & 29C)
Capability
60+5 sec/Tray(2PCB arrays)
Pick & place unit
Vacuum filter & vacuum
Pick & place unit
ection ionizer system
Cutting position accuracy
Under x/y ±100μm
Laser system
Wave length 1,064μm
Max power
150W
Cooling
Water cooling chiller
Max marking area
50ⅹ50mm(Unit)

This machine cuts a PCB plate into individual units using a laser.

 Laser Cutting System 상세정보 안내

Laser Cutting System

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