SemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductor
Semiconductor

Marking & Trim/Form System

Model
SSDIP 25L/38L
Press Type
Cam press
Controller
PLC
Display Panel
Touch screen LCD
On / Loader
2 Magazine
Offloader
Tube stack
Productivity
More than 40 SPM
Laser
EO Technics
Vision
Marking & Lead Inspection
Dimension
2,400(W) x 2,200(D) x 1,600(H)mm
This is the equipment designed to cut the lead of semi-conductor device using die tool fabricated in a certain shape and remove mold impurities, or modify the lead into desired shape and mark logos, number etc by laser on the package surface.
 Marking & Trim/Form System 상세정보 안내

Marking & Trim/Form System

Model : SSDIP 25L/38L

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