SemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductor
Semiconductor

Die Coating System

UPH
More than 6.5K
MTBF
1 Month
MTBA
1 Day
Machine dimension
1,160 x 770 x 1,756 ( W x D x H ,mm )

- Multimagazine stackable onloader & unloader(3~5 Magazine) - Controlled by PLC - Conversion time within 15 Minutes. - Two spray valves having each controller - Feeding by Servo motor & gripper his machine coats the lead frame attached to the die after the wire bonding process. Spraying a coating on the die makes it easier to mold the die efficiently. Since the machine is universal, it can accommodate many different lead frame types.

 Die Coating System 상세정보 안내

Die Coating System

Facebook Twitter GooglePlus KakaoStory NaverBand 프린트
    • Follow US :