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Semiconductor

Wire Bonding Handler

Main Power
220V, 3Phase, 50Hz, 30A
Main Air Pressure
5Kgf/㎠
Size(mm)
5,700(L) X 1,700(W) X 1,500(H)

This handler is to supply lead frame with multiple pockets and load DBC on each pocket of lead frame. Then, 3 sets of bonding heads conducts wire bonding. After wire bonding, lead frames are put into magazine. This handler is equipped with vision system to inspect lead frame orientation and wire bonding.

 Wire Bonding Handler 상세정보 안내

Wire Bonding Handler

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