Wire Loop Height Inspection System

Test Spec
Loop Height Inspection: ±50μm
Test Spec
Chip Height Inspection: ±10μm
AC220V, 3Phase, 60Hz

After the wire bonding process, the loop height is measured by a laser sensor. Then the machine sorts the components according to loop height.

 Wire Loop Height Inspection System 상세정보 안내
Wire Loop Height Inspection System

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